Application Engineer Intern - Package and Interposer Design page is loaded
Application Engineer Intern - Package and Interposer Design
Apply locations BELO HORIZONTE time type Part time posted on Posted 4 Days Ago job requisition id R45457At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Cadence Design Systems is looking for a candidate to join the Silicon Package Board (SPB) team as an intern focused on Advanced Packaging Design . If you like to architect and develop solutions for challenging problems in a fast and innovative paced environment, using state of the art technology this is a great opportunity.
This position is located in Belo Horizonte-MG.
Job Description:
The Candidate will be trained on the Cadence Integrated Circuit (IC) Package Design tool set, working with state-of-the-art complex IC packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies. Understand of competitive technologies is a plus. Ability to understand schematic, layout, interposers, integrated components.
Key responsibilities in this position are to:
- Helping customers to adopt and proliferate our packaging solutions
- Conducting technical presentations, technical training, and product demonstrations, including development of customized presentations
- Supporting technical evaluations and benchmarks
- Help R&D and product engineers develop competitive and creative technical solutions
The ideal candidate will be self-motivated, have strong problem-solving skills and able to work independently with minimal supervision.
Minimum Requirements
- Enrolled on Electrical, Electronics, System Engineering, computer science or related areas on progress
- Excellent written and verbal communication skills
- Interest in learning new technologies
- Open to continued personal development to meet the evolving demands of the EDA industry
- One to two years to graduate
Nice to have skills
- Previous experience with Package or PCB Design
- Knowledge of EDA industry, Signal and Power Integrity
- Electromagnetics, and RF related to IC Package and PCB Design are desirable
- Ability to present and clearly articulate
- Knowledge of scripting programming languages such as Tcl, Perl, Python, bash, csh
Additional Job Details:
- Internship term: 20 hours/week
- Location: Av. do Contorno, 5800, Savassi - Belo Horizonte
About Cadence Design Systems:
Cadence is the only company that provides the expertise and tools, IP, and hardware required for the entire electronics design chain, from chip design to chip packaging to boards and to systems. We enable electronic systems and semiconductor companies to create innovative products that transform the way people live, work, and play. Our products are used in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. For more information, access
We’re doing work that matters. Help us solve what others can’t.
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Thanks to the outstanding caliber of the Cadence team and the empowering culture that we have cultivated for over 25 years, Cadence continues to be recognized by Fortune Magazine as one of the 100 Best Companies to Work For. Our shared passion for solving the world’s toughest technical challenges, our dedication to pushing the limits of the industry, and our drive to do meaningful work differentiates the people of Cadence.
Cadence is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, sex, age, national origin, religion, sexual orientation, gender identity, status as a veteran, basis of disability, or any other protected class.